MC68LC302AF25CT Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 8 Weeks
Package / Case 100-LQFP
Operating Temperature 0°C~70°C TA
Packaging Tray
Series M683xx
Published 1995
JESD-609 Code e3
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 3A991.A.2
Terminal Finish Tin (Sn)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC68LC302
Speed 25MHz
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor M68000
Voltage - I/O 5.0V
Number of Cores/Bus Width 1 Core 8/16-Bit
Graphics Acceleration No
RAM Controllers DRAM
Additional Interfaces GCI, IDL, ISDN, NMSI, PCM, SCPI
Co-Processors/DSP Communications; RISC CPM
RoHS Status ROHS3 Compliant
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