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MC7447AHX1167NB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 360-BCBGA, FCCBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC74xx
Published 1994
JESD-609 Code e0
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 360Terminations
ECCN Code 3A991.A.1
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature ALSO REQUIRES 1.8V OR 2.5V SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MC7447
JESD-30 Code S-CBGA-B360
Supply Voltage-Max (Vsup) 1.35V
Supply Voltage-Min (Vsup) 1.25V
Speed 1.167GHZ
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC G4
Clock Frequency 167MHz
Bit Size 32
Address Bus Width 36
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
Co-Processors/DSP Multimedia; SIMD
Length 25mm
Height Seated (Max) 3.24mm
RoHS Status Non-RoHS Compliant
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