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MCIMX233CAG4C Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 128-LQFP
Operating Temperature -40°C~85°C TA
Packaging Tray
Series i.MX23
Published 2004
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 5A992
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCIMX233
Speed 454MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Core Processor ARM926EJ-S
Voltage - I/O 2.0V 2.5V 2.7V 3.0V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 2.0 + PHY (1)
Additional Interfaces I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, SSP, UART
Co-Processors/DSP Data; DCP
Security Features Cryptography, Hardware ID
Display & Interface Controllers LCD, Touchscreen
RoHS Status ROHS3 Compliant
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MCIMX233CAG4C Documents

Download datasheets and manufacturer documentation for   MCIMX233CAG4C

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