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MCIMX356AJQ5C Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 400-LFBGA
Surface Mount YES
Number of I/Os 3I/Os
Usage Level Automotive grade
Operating Temperature -40°C~85°C TA
Packaging Tray
Series i.MX35
Published 2008
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400Terminations
ECCN Code 5A992
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number MCIMX356
JESD-30 Code S-PBGA-B400
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.47V
Supply Voltage-Min (Vsup) 1.33V
Speed 532MHz
Core Processor ARM1136JF-S
Boundary Scan YES
Screening Level AEC-Q100
Voltage - I/O 1.8V 2.0V 2.5V 2.7V 3.0V 3.3V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR, DDR2
USB USB 2.0 + PHY (2)
Additional Interfaces 1-Wire, ASRC, ATA, CAN, I2C, I2S, MMC/SDIO, SAI, SDHC, SPI, SSI, UART
Co-Processors/DSP Multimedia; GPU, IPU, VFP
Bus Compatibility CAN; ETHERNET; I2C; I2S; IRDA; PCI; RS-232; SPI; UART; USB
Security Features Secure Fusebox, Secure JTAG
Display & Interface Controllers Keypad, KPP, LCD
Length 17mm
Height Seated (Max) 1.6mm
RoHS Status ROHS3 Compliant
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MCIMX356AJQ5C Documents

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