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MCIMX507CVM8B Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature 0°C~70°C TA
Packaging Tray
Series i.MX50
Published 2008
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400Terminations
ECCN Code 5A992
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.225V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCIMX507
JESD-30 Code S-PBGA-B400
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.275V
Supply Voltage-Min (Vsup) 1.175V
Speed 800MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor ARM® Cortex®-A8
Clock Frequency 800MHz
Boundary Scan YES
RAM (words) 131072
Voltage - I/O 1.2V 1.875V 2.775V 3.0V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR, LPDDR2, DDR2
USB USB 2.0 + PHY (2)
Additional Interfaces 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features Boot Security, Cryptography, Secure JTAG
Display & Interface Controllers LCD
Length 17mm
Height Seated (Max) 1.6mm
RoHS Status ROHS3 Compliant
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MCIMX507CVM8B Documents

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