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MCIMX515DJM8C Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 529-LFBGA
Surface Mount YES
Operating Temperature -20°C~85°C TC
Packaging Tray
Series i.MX51
Published 1997
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 529Terminations
ECCN Code 5A992
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCIMX515
JESD-30 Code S-PBGA-B529
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.15V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.05V
Speed 800MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor ARM® Cortex®-A8
Voltage - I/O 1.2V 1.875V 2.775V 3.0V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR, DDR2
USB USB 2.0 (3), USB 2.0 + PHY (1)
Additional Interfaces 1-Wire, AC'97, I2C, I2S, MMC/SD, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC
Display & Interface Controllers Keypad, LCD
Length 19mm
Height Seated (Max) 1.6mm
RoHS Status ROHS3 Compliant
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MCIMX515DJM8C Documents

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