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MCIMX535DVV1C Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 529-FBGA
Surface Mount YES
Number of I/Os 19I/Os
Operating Temperature -20°C~85°C TC
Packaging Tray
Series i.MX53
Published 2008
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 529Terminations
ECCN Code 5A992
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.25V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCIMX535
JESD-30 Code S-PBGA-B529
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.4V
Power Supplies 0.9/1.251.3V
Supply Voltage-Min (Vsup) 1.2V
Speed 1.0GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor ARM® Cortex®-A8
Clock Frequency 27MHz
Address Bus Width 16
Boundary Scan YES
External Data Bus Width 32
RAM (words) 144K
Voltage - I/O 1.3V 1.8V 2.775V 3.3V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR2, DDR3
USB USB 2.0 (2), USB 2.0 + PHY (2)
Additional Interfaces 1-Wire, AC'97, CAN, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Bus Compatibility ETHERNET; I2C; I2S; IRDA; RS-232; SPI; UART; USB
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
SATA SATA 1.5Gbps (1)
Length 19mm
Height Seated (Max) 1.85mm
RoHS Status ROHS3 Compliant
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MCIMX535DVV1C Documents

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