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MCIMX6DP5EYM1AB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 624-LFBGA, FCBGA
Operating Temperature -20°C~105°C TJ
Packaging Tray
Series i.MX6DP
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 1.0GHz
Core Processor ARM® Cortex®-A9
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, DDR3L, DDR3
USB USB 2.0 + PHY (3), USB 2.0 OTG + PHY (1)
Additional Interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers HDMI, Keypad, LCD, LVDS, MIPI/DSI, Parallel
SATA SATA 3Gbps (1)
RoHS Status ROHS3 Compliant
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MCIMX6DP5EYM1AB Documents

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