MCIMX6G3CVM05AB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 289-LFBGA
Surface Mount YES
Number of I/Os 131I/Os
Operating Temperature -40°C~105°C TJ
Packaging Tray
Series i.MX6UL
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 289Terminations
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B289
Supply Voltage-Max (Vsup) 1.3V
Supply Voltage-Min (Vsup) 1.15V
Speed 528MHz
Core Processor ARM® Cortex®-A7
Address Bus Width 16
Boundary Scan YES
External Data Bus Width 16
RAM (words) 128000
Voltage - I/O 1.2V 1.35V 1.5V 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers LPDDR2, DDR3, DDR3L
USB USB 2.0 + PHY (2)
Additional Interfaces CAN, EBI/EMI, I2C, I2S, MMC/SD/SDIO, QSPI, SAI, SPI, SSI, S/PDIF, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Bus Compatibility CAN; ETHERNET; I2C; SPI; UART; USB
Security Features ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS
Display & Interface Controllers LCD, LVDS
Length 14mm
Height Seated (Max) 1.32mm
RoHS Status ROHS3 Compliant
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