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MCIMX6L2EVN10AB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 432-TFBGA
Surface Mount YES
Number of I/Os 162I/Os
Operating Temperature -40°C~105°C TA
Packaging Tray
Series i.MX6SL
Published 2002
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 576Terminations
ECCN Code 5A992
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MCIMX6
JESD-30 Code S-PBGA-B
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.5V
Supply Voltage-Min (Vsup) 1.375V
Speed 1.0GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A9
Bit Size 32
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
RAM (words) 32000
Voltage - I/O 1.2V 1.8V 3.0V
Ethernet 10/100Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (3)
Additional Interfaces AC97, I2C, I2S, MMC/SD/SDIO, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Bus Compatibility CAN; ETHERNET; IRDA; I2C; I2S; SPI; UART; USB
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
Length 13mm
Height Seated (Max) 1.1mm
RoHS Status ROHS3 Compliant
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