MCIMX6Q5EYM10ADR Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 624-LFBGA, FCBGA
Operating Temperature -20°C~105°C TJ
Packaging Tape & Reel (TR)
Series i.MX6Q
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 1.0GHz
Core Processor ARM® Cortex®-A9
Voltage - I/O 1.8V 2.5V 2.8V 3.3V
Ethernet 10/100/1000Mbps (1)
Number of Cores/Bus Width 4 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (4)
Additional Interfaces CAN, I2C, I2S, MMC/SD/SDIO, SAI, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
Display & Interface Controllers Keypad, LCD
SATA SATA 3Gbps (1)
RoHS Status ROHS3 Compliant
Select at least one checkbox above to show similar products in this category.
View Similar

MCIMX6Q5EYM10ADR Documents

Download datasheets and manufacturer documentation for   MCIMX6Q5EYM10ADR

MCIMX6Q5EYM10ADR brand manufacturers: NXP USA Inc., Elecinsight stock, MCIMX6Q5EYM10ADR reference price.NXP USA Inc.. MCIMX6Q5EYM10ADR parameters, MCIMX6Q5EYM10ADR Datasheet PDF and pin diagram description download.You can use the MCIMX6Q5EYM10ADR Embedded - Microprocessors, DSP Datesheet PDF, find MCIMX6Q5EYM10ADR pin diagram and circuit diagram and usage method of function,MCIMX6Q5EYM10ADR electronics tutorials.You can download from the Elecinsight.