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MCIMX6V7DVN10AB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 432-TFBGA
Operating Temperature 0°C~95°C TJ
Packaging Tray
Series i.MX6SLL
Published 2002
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 1GHz
Core Processor ARM® Cortex®-A9
Voltage - I/O 1.2V 1.8V 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LPDDR3
USB USB 2.0 OTG + PHY (2)
Co-Processors/DSP Multimedia; NEON™ SIMD
Security Features A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers EPDC, LCD
RoHS Status ROHS3 Compliant
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MCIMX6V7DVN10AB Documents

Download datasheets and manufacturer documentation for   MCIMX6V7DVN10AB

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