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MCIMX6X3CVN08AB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 15 Weeks
Package / Case 400-LFBGA
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Series i.MX6SX
Published 2002
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 400Terminations
ECCN Code 5A992
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B400
Supply Voltage-Max (Vsup) 1.5V
Supply Voltage-Min (Vsup) 1.275V
Speed 200MHz, 800MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A9, ARM® Cortex®-M4
Address Bus Width 15
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V 2.8V 3.15V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Additional Interfaces AC'97, CAN, I2C, I2S, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART
Co-Processors/DSP Multimedia; NEON™ MPE
Security Features A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers Keypad, LCD
Length 17mm
Height Seated (Max) 1.53mm
RoHS Status ROHS3 Compliant
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MCIMX6X3CVN08AB Documents

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