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MCIMX6X4AVM08AC Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 14 Weeks
Package / Case 529-LFBGA
Operating Temperature -40°C~125°C TJ
Packaging Tray
Series i.MX6SX
Published 2017
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 200MHz, 800MHz
Core Processor ARM® Cortex®-A9, ARM® Cortex®-M4
Voltage - I/O 1.8V 2.5V 2.8V 3.15V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers LPDDR2, LVDDR3, DDR3
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Additional Interfaces AC'97, CAN, I2C, I2S, MLB, MMC/SD/SDIO, PCIe, SAI, SPDIF, SPI, SSI, UART, VADC
Co-Processors/DSP Multimedia; NEON™ MPE
Security Features A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE
Display & Interface Controllers Keypad, LCD, LVDS
RoHS Status ROHS3 Compliant
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MCIMX6X4AVM08AC Documents

Download datasheets and manufacturer documentation for   MCIMX6X4AVM08AC

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