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MCIMX6Y2DVM09AB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 18 Weeks
Package / Case 289-LFBGA
Operating Temperature 0°C~95°C TJ
Packaging Tray
Series i.MX6
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Speed 900MHz
Core Processor ARM® Cortex®-A7
Voltage - I/O 1.8V 2.8V 3.3V
Ethernet 10/100Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers LPDDR2, DDR3, DDR3L
USB USB 2.0 OTG + PHY (2)
Additional Interfaces CAN, I2C, SPI, UART
Co-Processors/DSP Multimedia; NEON™ MPE
Security Features A-HAB, ARM TZ, CSU, SJC, SNVS
Display & Interface Controllers Electrophoretic, LCD
RoHS Status ROHS3 Compliant
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MCIMX6Y2DVM09AB Documents

Download datasheets and manufacturer documentation for   MCIMX6Y2DVM09AB

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