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MCIMX7D2DVM12SC Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 18 Weeks
Package / Case 541-LFBGA
Surface Mount YES
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series i.MX7D
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 541Terminations
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.225V
Terminal Pitch 0.75mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B541
Supply Voltage-Max (Vsup) 1.25V
Supply Voltage-Min (Vsup) 1.2V
Speed 1.2GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor ARM® Cortex®-A7, ARM® Cortex®-M4
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration No
RAM Controllers LPDDR2, LPDDR3, DDR3, DDR3L
USB USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2)
Additional Interfaces AC'97, CAN, eCSPI, I2C, I2S, MMC/SD/SDIO, PCIe, QSPI, SAI, UART
Co-Processors/DSP Multimedia; NEON™ MPE
Security Features A-HAB, ARM TZ, CAAM, CSU, SJC, SNVS
Display & Interface Controllers Keypad, LCD, MIPI
Length 19mm
Height Seated (Max) 1.42mm
RoHS Status ROHS3 Compliant
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MCIMX7D2DVM12SC Documents

Download datasheets and manufacturer documentation for   MCIMX7D2DVM12SC

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