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MIMX8MD6CVAHZAA Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Package / Case 621-FBGA, FCBGA
Surface Mount YES
Number of I/Os 16I/Os
Operating Temperature -40°C~105°C TJ
Packaging Tray
Series i.MX8MD
Part Status Not For New Designs
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 621Terminations
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.65mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B621
Supply Voltage-Max (Vsup) 1.05V
Supply Voltage-Min (Vsup) 0.9V
Speed 1.3GHz
Core Processor ARM® Cortex®-A53
Clock Frequency 40MHz
Boundary Scan YES
RAM (words) 160K
Ethernet GbE
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers DDR3L, DDR4, LPDDR4
USB USB 3.0 (2)
Additional Interfaces EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Co-Processors/DSP ARM® Cortex®-M4
Bus Compatibility ETHERNET; I2C; I2S; PCI; RS-232; SPI; UART; USB
Security Features ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers eDP, HDMI, MIPI-CSI, MIPI-DSI
Length 17mm
Height Seated (Max) 2.18mm
RoHS Status RoHS Compliant
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