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MIMX8MQ6DVAJZAA Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 16 Weeks
Package / Case 621-FBGA, FCBGA
Operating Temperature 0°C~95°C TJ
Packaging Tray
Series i.MX8MQ
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Peak Reflow Temperature (Cel) 260
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Speed 1.5GHz
Core Processor ARM® Cortex®-A53
Ethernet GbE
Number of Cores/Bus Width 4 Core 32-Bit
Graphics Acceleration Yes
RAM Controllers DDR3L, DDR4, LPDDR4
USB USB 3.0 (2)
Additional Interfaces EBI/EMI, I2C, PCIe, SPI, UART, uSDHC
Co-Processors/DSP ARM® Cortex®-M4
Security Features ARM TZ, CAAM, HAB, RDC, RTC, SJC, SNVS
Display & Interface Controllers eDP, HDMI, MIPI-CSI, MIPI-DSI
RoHS Status RoHS Compliant
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MIMX8MQ6DVAJZAA Documents

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