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MK10DN512VLQ10 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer NXP
Factory Lead Time 13 Weeks
Surface Mount YES
Package / Case 144-LQFP
Mounting Type Surface Mount
ROM(word) 524288
Number of I/Os 104I/Os
Data Converters A/D 46x16b; D/A 2x12b
Published 2012
Series Kinetis K10
Packaging Tray
Operating Temperature -40°C~105°C TA
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MK10DN512
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.3V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 100MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 32MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, I2C, IrDA, SD, SPI, UART/USART
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
CPU Family CORTEX-M4
Width 20mm
Height Seated (Max) 1.6mm
Length 20mm
RoHS Status ROHS3 Compliant
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