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MK60FN1M0VLQ12 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer NXP
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 144-LQFP
Surface Mount YES
Data Converters A/D 58x16b; D/A 2x12b
Number of I/Os 100I/Os
ROM(word) 1048576
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis K60
Published 2002
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MK60FN1M0
JESD-30 Code S-PQFP-G144
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.3V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 120MHz
RAM Size 128K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 50MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 1MB 1M x 8
Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Bit Size 32
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
CPU Family CORTEX-M4F
Length 20mm
Height Seated (Max) 1.6mm
Width 20mm
RoHS Status ROHS3 Compliant
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