MK64FX512VMD12 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer NXP
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 144-LBGA
Surface Mount YES
Data Converters A/D 41x16b; D/A 2x12b
Number of I/Os 100I/Os
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis K60
Published 2002
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 144Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
JESD-30 Code S-PBGA-B144
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 120MHz
RAM Size 192K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M4
Peripherals DMA, I2S, LVD, POR, PWM, WDT
Clock Frequency 50MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 512KB 512K x 8
Connectivity CANbus, EBI/EMI, Ethernet, I2C, IrDA, SD, SPI, UART/USART, USB, USB OTG
Has ADC YES
DMA Channels YES
PWM Channels YES
DAC Channels YES
EEPROM Size 4K x 8
Length 13mm
Width 13mm
RoHS Status ROHS3 Compliant
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