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MKL03Z32VFG4 Tech Specifications

Category Embedded - Microcontrollers
Manufacturer NXP
Factory Lead Time 13 Weeks
Mounting Type Surface Mount
Package / Case 16-UFQFN Exposed Pad
Surface Mount YES
Data Converters A/D 7x12b
Number of I/Os 14I/Os
ROM(word) 32768
Operating Temperature -40°C~105°C TA
Packaging Tray
Series Kinetis KL03
Published 2002
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 16Terminations
ECCN Code 3A991.A.2
Terminal Finish Matte Tin (Sn)
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form NO LEAD
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MKL03Z32
JESD-30 Code S-XQCC-N16
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 1.8/3.3V
Supply Voltage-Min (Vsup) 1.71V
Oscillator Type Internal
Speed 48MHz
RAM Size 2K x 8
Voltage - Supply (Vcc/Vdd) 1.71V~3.6V
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC
Core Processor ARM® Cortex®-M0+
Peripherals Brown-out Detect/Reset, LVD, POR, PWM, WDT
Clock Frequency 24MHz
Program Memory Type FLASH
Core Size 32-Bit
Program Memory Size 32KB 32K x 8
Connectivity I2C, SPI, UART/USART
Bit Size 32
Has ADC YES
DMA Channels NO
PWM Channels YES
DAC Channels NO
CPU Family CORTEX-M0
Length 3mm
Width 3mm
RoHS Status ROHS3 Compliant
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