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MM912F634DV2AP Tech Specifications

Category Embedded - Microcontrollers - Application Specific
Manufacturer NXP
Factory Lead Time 16 Weeks
Surface Mount YES
Package / Case 48-LQFP
Mounting Type Surface Mount
Number of I/Os 9I/Os
Published 2010
Packaging Tray
Operating Temperature -40°C~105°C
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
Terminal Finish Matte Tin (Sn)
Applications Automotive
Voltage - Supply 2.25V~5.5V
Terminal Position QUAD
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Supply Voltage 7V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MM912F634
JESD-30 Code S-PQFP-G48
Interface LIN, SCI
RAM Size 2K x 8
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor S12
Program Memory Type FLASH (32KB)
Controller Series HCS12
Length 7mm
Width 7mm
Height Seated (Max) 1.6mm
RoHS Status ROHS3 Compliant
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MM912F634DV2AP Documents

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