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MPC755BPX300LE Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Package / Case 360-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC7xx
Published 2001
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 360Terminations
ECCN Code 3A991
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 2V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC755
JESD-30 Code S-PBGA-B360
Supply Voltage-Max (Vsup) 2.1V
Supply Voltage-Min (Vsup) 1.8V
Speed 300MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC
Clock Frequency 100MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
Length 25mm
Height Seated (Max) 2.77mm
RoHS Status Non-RoHS Compliant
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