Elecinsight electronic parts stores,electronic components,electronic parts,electronics parts supply
My List
Order Status & History RFQ History WISH LIST
$ 0.00

MPC755CPX400LE Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Package / Case 360-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC7xx
Published 2001
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 360Terminations
ECCN Code 3A991
Terminal Finish TIN LEAD
Additional Feature ALSO REQUIRES 2.5V OR 3.3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 2V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC755
JESD-30 Code S-PBGA-B360
Supply Voltage-Max (Vsup) 2.1V
Supply Voltage-Min (Vsup) 1.9V
Speed 400MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC
Clock Frequency 100MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 2.5V 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
Length 25mm
Height Seated (Max) 2.77mm
RoHS Status Non-RoHS Compliant
Select at least one checkbox above to show similar products in this category.
View Similar

MPC755CPX400LE Documents

Download datasheets and manufacturer documentation for   MPC755CPX400LE

MPC755CPX400LE brand manufacturers: NXP USA Inc., Elecinsight stock, MPC755CPX400LE reference price.NXP USA Inc.. MPC755CPX400LE parameters, MPC755CPX400LE Datasheet PDF and pin diagram description download.You can use the MPC755CPX400LE Embedded - Microprocessors, DSP Datesheet PDF, find MPC755CPX400LE pin diagram and circuit diagram and usage method of function,MPC755CPX400LE electronics tutorials.You can download from the Elecinsight.