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MPC8241TVR200D Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 357-BBGA
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Series MPC82xx
Published 1998
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 357Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC8241
JESD-30 Code S-PBGA-B357
Supply Voltage-Max (Vsup) 1.9V
Supply Voltage-Min (Vsup) 1.7V
Speed 200MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC 603e
Clock Frequency 66MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers SDRAM
Additional Interfaces I2C, I2O, PCI, UART
Length 25mm
Height Seated (Max) 2.56mm
RoHS Status ROHS3 Compliant
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MPC8241TVR200D Documents

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