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MPC8245LZU333D Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 352-LBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC82xx
Published 1998
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 352Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 220
Supply Voltage 2V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC8245
JESD-30 Code S-PBGA-B352
Supply Voltage-Max (Vsup) 2.2V
Power Supplies 23.3V
Supply Voltage-Min (Vsup) 1.9V
Speed 333MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC 603e
Clock Frequency 66MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 3.3V
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers SDRAM
Additional Interfaces I2C, I2O, PCI, UART
Length 35mm
Height Seated (Max) 1.65mm
RoHS Status Non-RoHS Compliant
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