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MPC8306CVMABDCA Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 10 Weeks
Package / Case 369-LFBGA
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Series MPC83xx
Published 2002
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 369Terminations
ECCN Code 3A991.A.2
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8306
JESD-30 Code S-PBGA-B369
Speed 133MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e300c3
Clock Frequency 66.67MHz
Bit Size 32
Boundary Scan YES
Low Power Mode YES
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 3.3V
Ethernet 10/100Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2
USB USB 2.0 (1)
Additional Interfaces CAN, DUART, I2C, MMC/SD, SPI, TDM
Co-Processors/DSP Communications; QUICC Engine
Length 19mm
Height Seated (Max) 1.61mm
RoHS Status ROHS3 Compliant
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