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MPC8308VMAGD Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Package / Case 473-LFBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC83xx
Published 2002
JESD-609 Code e2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 473Terminations
ECCN Code 3A991.A.2
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8308
JESD-30 Code S-PBGA-B473
Speed 400MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e300c3
Voltage - I/O 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2
USB USB 2.0 (1)
Additional Interfaces DUART, HSSI, I2C, MMC/SD/SDIO, SPI
RoHS Status ROHS3 Compliant
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