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MPC8313ECVRADDC Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 8 Weeks
Package / Case 516-BBGA Exposed Pad
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Series MPC83xx
Published 2002
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 516Terminations
ECCN Code 5A002.A.1
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8313
JESD-30 Code S-PBGA-B516
Supply Voltage-Max (Vsup) 1.05V
Power Supplies 11.8/2.53.3V
Supply Voltage-Min (Vsup) 0.95V
Speed 267MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e300c3
Bit Size 32
Address Bus Width 15
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, DDR2
USB USB 2.0 + PHY (1)
Additional Interfaces DUART, HSSI, I2C, PCI, SPI
Co-Processors/DSP Security; SEC 2.2
Security Features Cryptography
Length 27mm
Height Seated (Max) 2.55mm
RoHS Status ROHS3 Compliant
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MPC8313ECVRADDC Documents

Download datasheets and manufacturer documentation for   MPC8313ECVRADDC

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