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MPC8343EVRAGDB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 620-BBGA Exposed Pad
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC83xx
Published 2002
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 620Terminations
ECCN Code 5A002.A.1
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8343
JESD-30 Code S-PBGA-B620
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.22.53.3V
Supply Voltage-Min (Vsup) 1.14V
Speed 400MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR
Core Processor PowerPC e300
Clock Frequency 66MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, DDR2
USB USB 2.0 + PHY (2)
Additional Interfaces DUART, I2C, PCI, SPI
Co-Processors/DSP Security; SEC
Security Features Cryptography, Random Number Generator
Length 29mm
Height Seated (Max) 2.46mm
RoHS Status ROHS3 Compliant
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MPC8343EVRAGDB Documents

Download datasheets and manufacturer documentation for   MPC8343EVRAGDB

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