Elecinsight electronic parts stores,electronic components,electronic parts,electronics parts supply
My List
Order Status & History RFQ History WISH LIST
$ 0.00

MPC850SRVR50BU Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Package / Case 256-BBGA
Surface Mount YES
Operating Temperature 0°C~95°C TA
Packaging Tray
Series MPC8xx
Published 1997
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 3.3V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC850
JESD-30 Code S-PBGA-B256
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Speed 50MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Address Bus Width 26
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 32
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
Length 23mm
Height Seated (Max) 2.54mm
RoHS Status ROHS3 Compliant
Select at least one checkbox above to show similar products in this category.
View Similar

MPC850SRVR50BU Documents

Download datasheets and manufacturer documentation for   MPC850SRVR50BU

MPC850SRVR50BU brand manufacturers: NXP USA Inc., Elecinsight stock, MPC850SRVR50BU reference price.NXP USA Inc.. MPC850SRVR50BU parameters, MPC850SRVR50BU Datasheet PDF and pin diagram description download.You can use the MPC850SRVR50BU Embedded - Microprocessors, DSP Datesheet PDF, find MPC850SRVR50BU pin diagram and circuit diagram and usage method of function,MPC850SRVR50BU electronics tutorials.You can download from the Elecinsight.