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MPC8541VTAPF Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 783-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC85xx
Published 2002
JESD-609 Code e2
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783Terminations
ECCN Code 5A992
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number MPC8541
JESD-30 Code R-PBGA-B783
Supply Voltage-Max (Vsup) 1.26V
Supply Voltage-Min (Vsup) 1.14V
Speed 833MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500
Clock Frequency 166MHz
Bit Size 32
Address Bus Width 64
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 2.5V 3.3V
Ethernet 10/100/1000Mbps (2)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR, SDRAM
Additional Interfaces DUART, I2C, PCI
Length 29mm
Height Seated (Max) 3.75mm
RoHS Status ROHS3 Compliant
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