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MPC8569ECVJAQLJB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 783-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Tray
Series MPC85xx
Published 2002
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783Terminations
ECCN Code 5A002.A.1
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B783
Supply Voltage-Max (Vsup) 1.03V
Power Supplies 12.5/3.3V
Supply Voltage-Min (Vsup) 0.97V
Speed 1.067GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500v2
Clock Frequency 133MHz
Bit Size 32
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 1.0V 1.5V 1.8V 2.5V 3.3V
Ethernet 10/100Mbps (8), 1Gbps (4)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, DDR3, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP Communications; QUICC Engine, Security; SEC
Security Features Cryptography, Random Number Generator
Length 29mm
Height Seated (Max) 3.94mm
RoHS Status ROHS3 Compliant
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