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MPC8569VJAUNLB Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 783-BBGA, FCBGA
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC85xx
Published 2002
JESD-609 Code e1
Part Status Last Time Buy
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 783Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
JESD-30 Code S-PBGA-B783
Power Supplies 12.5/3.3V
Speed 1.333GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500v2
Bit Size 32
Voltage - I/O 1.0V 1.5V 1.8V 2.5V 3.3V
Ethernet 10/100Mbps (8), 1Gbps (4)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, DDR3, SDRAM
USB USB 2.0 (1)
Additional Interfaces DUART, HSSI, I2C, MMC/SD, PCI, RapidIO, SPI, TDM, UART
Co-Processors/DSP Communications; QUICC Engine
RoHS Status ROHS3 Compliant
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