MPC8572ECVJARLE Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 18 Weeks
Package / Case 1023-BBGA, FCBGA
Surface Mount YES
Operating Temperature -40°C~105°C TA
Packaging Box
Series MPC85xx
Published 1998
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
ECCN Code 5A002.A.1
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.1V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MPC8572
JESD-30 Code S-PBGA-B1023
Supply Voltage-Max (Vsup) 1.155V
Supply Voltage-Min (Vsup) 1.045V
Speed 1.067GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500
Clock Frequency 133MHz
Bit Size 32
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FIXED POINT
Integrated Cache YES
Voltage - I/O 1.5V 1.8V 2.5V 3.3V
Ethernet 10/100/1000Mbps (4)
Number of Cores/Bus Width 2 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, DDR3
Additional Interfaces DUART, HSSI, I2C, RapidIO
Co-Processors/DSP Signal Processing; SPE, Security; SEC
Security Features Cryptography, Random Number Generator
Length 33mm
Height Seated (Max) 3.38mm
RoHS Status ROHS3 Compliant
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