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P2010NXN2HFC Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Factory Lead Time 12 Weeks
Package / Case 689-BBGA Exposed Pad
Surface Mount YES
Operating Temperature -40°C~125°C TA
Packaging Tray
Series QorIQ P2
Published 2002
JESD-609 Code e2
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 689Terminations
ECCN Code 3A991.A.2
Terminal Finish TIN COPPER/TIN SILVER
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.05V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number P2010
JESD-30 Code S-PBGA-B689
Supply Voltage-Max (Vsup) 1.1V
Supply Voltage-Min (Vsup) 1V
Speed 1.2GHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC e500v2
Clock Frequency 100MHz
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Format FLOATING POINT
Integrated Cache YES
Ethernet 10/100/1000Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DDR2, DDR3
USB USB 2.0 + PHY (2)
Additional Interfaces DUART, I2C, MMC/SD, SPI
Length 31mm
Height Seated (Max) 2.46mm
RoHS Status ROHS3 Compliant
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