NXP USA Inc. SE97BTP,547 Thermal Management ICs
Tape & Reel (TR) -40°C~125°C
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SE97BTP,547 Tech Specifications
| Category | PMIC - Thermal Management | |
| Manufacturer | NXP | |
| Factory Lead Time | 14 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-WFDFN Exposed Pad | |
| Operating Temperature | -40°C~125°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2005 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Voltage - Supply | 3V~3.6V |
| Base Part Number | SE97 | |
| Function | Temp Monitoring System (Sensor), DIMM DDR Memory | |
| Output Type | I2C/SMBus | |
| Accuracy | ±3°C(Max) | |
| Topology | ADC (Sigma Delta), Comparator, Register Bank | |
| Sensor Type | Internal | |
| Source Url Status Check Date | 2013-06-14 00:00:00 | |
| Output Alarm | Yes | |
| Sensing Temperature | -40°C~125°C | |
| RoHS Status | ROHS3 Compliant |
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SE97BTP,547 Documents
Download datasheets and manufacturer documentation for SE97BTP,547
- DatasheetsSE97B
- Environmental InformationNXP RoHS3 Cert
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