NXP USA Inc. SE97TP,128 Thermal Management ICs
-40°C~125°C Tape & Reel (TR)
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SE97TP,128 Tech Specifications
| Category | PMIC - Thermal Management | |
| Manufacturer | NXP | |
| Package / Case | 8-WFDFN Exposed Pad | |
| Surface Mount | YES | |
| Mounting Type | Surface Mount | |
| Packaging | Tape & Reel (TR) | |
| Published | 2009 | |
| Operating Temperature | -40°C~125°C | |
| JESD-609 Code | e3 | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Terminal Finish | Matte Tin (Sn) | |
| Voltage - Supply | 3V~3.6V | |
| Reach Compliance Code | unknown | |
| Base Part Number | SE97 | |
| Function | Temp Monitoring System (Sensor), DIMM DDR Memory |
| Body Length or Diameter | 3mm | |
| Body Breadth | 2 mm | |
| Output Type | 2-Wire Serial, I2C/SMBUS | |
| Termination Type | SOLDER | |
| Number of Bits | 11Bits | |
| Accuracy | ±3°C | |
| Topology | ADC (Sigma Delta), Comparator, Register Bank | |
| Sensor Type | Internal | |
| Sensors/Transducers Type | TEMPERATURE SENSOR,SWITCH/DIGITAL OUTPUT,SERIAL | |
| Housing | PLASTIC | |
| Output Interface Type | 2-WIRE INTERFACE | |
| Output Alarm | Yes | |
| Sensing Temperature | -40°C~125°C | |
| Body Height | 0.8mm | |
| RoHS Status | ROHS3 Compliant |
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SE97TP,128 Documents
Download datasheets and manufacturer documentation for SE97TP,128
- DatasheetsSE97
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