NXP USA Inc. SE98ATP,547 Thermal Management ICs
-40°C~125°C Tape & Reel (TR) 8Terminations
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SE98ATP,547 Tech Specifications
| Category | PMIC - Thermal Management | |
| Manufacturer | NXP | |
| Factory Lead Time | 7 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 8-WFDFN Exposed Pad | |
| Surface Mount | YES | |
| Operating Temperature | -40°C~125°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2003 | |
| JESD-609 Code | e4 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 8Terminations |
| Terminal Finish | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | |
| Voltage - Supply | 1.7V~3.6V | |
| Base Part Number | SE98 | |
| Function | Temp Monitoring System (Sensor) | |
| Output Type | I2C/SMBus | |
| Power Supplies | 1.8/3.3V | |
| Accuracy | ±4°C(Max) | |
| Topology | ADC (Sigma Delta), Register Bank | |
| Sensor Type | Internal | |
| Output Alarm | Yes | |
| Sensing Temperature | -40°C~125°C | |
| RoHS Status | ROHS3 Compliant |
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SE98ATP,547 Documents
Download datasheets and manufacturer documentation for SE98ATP,547
- DatasheetsSE98A
- Environmental InformationNXP RoHS3 Cert
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