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XPC8260VVIHBC Tech Specifications

Category Embedded - Microprocessors
Manufacturer NXP
Package / Case 480-LBGA Exposed Pad
Surface Mount YES
Operating Temperature 0°C~105°C TA
Packaging Tray
Series MPC82xx
Published 2004
JESD-609 Code e1
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 480Terminations
ECCN Code 3A991.A.2
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 245
Supply Voltage 1.8V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number PC8260
JESD-30 Code S-PBGA-B480
Supply Voltage-Max (Vsup) 1.9V
Supply Voltage-Min (Vsup) 1.7V
Speed 200MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Core Processor PowerPC G2
Clock Frequency 66.66MHz
Bit Size 32
Address Bus Width 32
Boundary Scan YES
Low Power Mode NO
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Voltage - I/O 3.3V
Ethernet 10/100Mbps (3)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM, SDRAM
Additional Interfaces I2C, SCC, SMC, SPI, UART, USART
Co-Processors/DSP Communications; RISC CPM
Length 37.5mm
Height Seated (Max) 1.65mm
RoHS Status ROHS3 Compliant
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XPC8260VVIHBC Documents

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