Omron Electronics Inc-EMC Div XR2C-3200-HSG Sockets for ICs & Transistors
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XR2C-3200-HSG Tech Specifications
| Category | Sockets for ICs, Transistors | |
| Manufacturer | Omron | |
| Factory Lead Time | 13 Weeks | |
| Mounting Type | Through Hole | |
| Number of Pins | 32Pins | |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | |
| Number of Positions or Pins (Grid) | 32 (1 x 32) | |
| Contact Material - Mating | Beryllium Copper | |
| Contact Material - Post | Beryllium Copper | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Bulk | |
| Series | XR2 | |
| Published | 2002 |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Wire Wrap | |
| Type | Housing | |
| Current Rating (Amps) | 1A | |
| Pitch | 2.54mm | |
| Pitch - Mating | 0.100 2.54mm | |
| Contact Resistance | 20mOhm | |
| Termination Post Length | 0.510 12.95mm | |
| Pitch - Post | 0.100 2.54mm | |
| Features | Closed Frame | |
| Material Flammability Rating | UL94 V-0 | |
| RoHS Status | RoHS Compliant |
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