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XR2E-3204 Tech Specifications
| Category | Sockets for ICs, Transistors | |
| Manufacturer | Omron | |
| Mounting Type | Through Hole | |
| Housing Material | Polybutylene Terephthalate (PBT), Glass Filled | |
| Number of Positions or Pins (Grid) | 32 (1 x 32) | |
| Contact Material - Mating | Beryllium Copper | |
| Contact Material - Post | Beryllium Copper | |
| Contact Finish Mating | Gold | |
| Operating Temperature | -55°C~125°C | |
| Packaging | Bulk | |
| Series | XR2 | |
| Published | 2002 | |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Termination | Solder | |
| Type | SIP | |
| Current Rating (Amps) | 1A | |
| Pitch - Mating | 0.100 2.54mm | |
| Contact Finish - Post | Gold | |
| Contact Resistance | 20mOhm | |
| Pitch - Post | 0.100 2.54mm | |
| Features | Closed Frame | |
| Contact Finish Thickness - Mating | 30.0μin 0.76μm | |
| Contact Finish Thickness - Post | 30.0μin 0.76μm | |
| Material Flammability Rating | UL94 V-0 |
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XR2E-3204 Documents
Download datasheets and manufacturer documentation for XR2E-3204
- DatasheetsXR2
- Other Related DocumentsHow to Read Date Codes
- PCN Obsolescence/ EOLXR2D/XR2E Series Apr/2012
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