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FDC608PZ Tech Specifications
| Category | Transistors - FETs, MOSFETs - Single | |
| Manufacturer | ON Semiconductor | |
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 13 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | SOT-23-6 Thin, TSOT-23-6 | |
| Number of Pins | 6Pins | |
| Weight | 36mg | |
| Transistor Element Material | SILICON | |
| Current - Continuous Drain (Id) @ 25℃ | 5.8A Ta | |
| Drive Voltage (Max Rds On, Min Rds On) | 2.5V 4.5V | |
| Number of Elements | 1 Element | |
| Power Dissipation (Max) | 1.6W Ta | |
| Turn Off Delay Time | 91 ns | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | PowerTrench® | |
| Published | 2006 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 6Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Resistance | 30MOhm | |
| Voltage - Rated DC | -20V | |
| Terminal Position | DUAL |
| Terminal Form | GULL WING | |
| Current Rating | -5.8A | |
| Element Configuration | Single | |
| Operating Mode | ENHANCEMENT MODE | |
| Power Dissipation | 1.6W | |
| Turn On Delay Time | 13 ns | |
| FET Type | P-Channel | |
| Rds On (Max) @ Id, Vgs | 30m Ω @ 5.8A, 4.5V | |
| Vgs(th) (Max) @ Id | 1.5V @ 250μA | |
| Input Capacitance (Ciss) (Max) @ Vds | 1330pF @ 10V | |
| Gate Charge (Qg) (Max) @ Vgs | 23nC @ 4.5V | |
| Rise Time | 8ns | |
| Drain to Source Voltage (Vdss) | 20V | |
| Vgs (Max) | ±12V | |
| Fall Time (Typ) | 8 ns | |
| Continuous Drain Current (ID) | 5.8A | |
| Threshold Voltage | -1V | |
| Gate to Source Voltage (Vgs) | 12V | |
| Drain to Source Breakdown Voltage | -20V | |
| Pulsed Drain Current-Max (IDM) | 20A | |
| Dual Supply Voltage | -20V | |
| Nominal Vgs | -1 V | |
| Height | 1mm | |
| Length | 3mm | |
| Width | 1.7mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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FDC608PZ Documents
Download datasheets and manufacturer documentation for FDC608PZ
- PCN Assembly/OriginMult Dev Assembly/Test Chg 30/Apr/2019
- PCN Design/SpecificationMold Compound 08/April/2008 FDC6x, NDC7003P Die 11/May/2007
- DatasheetsFDC608PZ-ON-Semiconductor-datasheet-85466394.pdf FDC608PZ-ON-Semiconductor-datasheet-86686977.pdf FDC608PZ-ON-Semiconductor-datasheet-81454778.pdf FDC608PZ-Fairchild-Semiconductor-datasheet-67910345.pdf FDC608PZ FDC608PZ-ON-Semiconductor-datasheet-120835.pdf FDC608PZ-ON-Semiconductor-datasheet-97399122.pdf FDC608PZ-Fairchild-Semiconductor-datasheet-14042592.pdf
- Environmental InformationMaterial Declaration FDC608PZ
- PCN PackagingBinary Year Code Marking 15/Jan/2014 Mult Devices 24/Oct/2017
- ReachStatementFairchild-Semiconductor-FDC608PZ.pdf
- TechnicalDrawingFairchild-Semiconductor-FDC608PZ.pdf
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