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FDMF6823B Tech Specifications
| Category | PMIC - Full, Half-Bridge Drivers | |
| Manufacturer | ON Semiconductor | |
| Lifecycle Status | ACTIVE (Last Updated: 2 days ago) | |
| Factory Lead Time | 16 Weeks | |
| Mount | Surface Mount | |
| Package / Case | Module | |
| Number of Pins | 40Pins | |
| Weight | 224mg | |
| Packaging | Tape & Reel (TR) | |
| Published | 2014 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 43Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin (Sn) | |
| Max Operating Temperature | 125°C | |
| Min Operating Temperature | -40°C | |
| Terminal Position | UNSPECIFIED | |
| Terminal Form | NO LEAD | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 5V | |
| Reach Compliance Code | not_compliant | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| JESD-30 Code | S-PXMA-N43 |
| Number of Outputs | 1Output | |
| Output Type | Adjustable | |
| Max Output Current | 55A | |
| Temperature Grade | AUTOMOTIVE | |
| Interface | PWM | |
| Max Supply Voltage | 5.5V | |
| Min Supply Voltage | 4.5V | |
| Nominal Supply Current | 2mA | |
| Output Current | 55A | |
| Max Output Voltage | 16V | |
| Min Input Voltage | 4.5V | |
| Max Input Voltage | 5.5V | |
| Output Current per Channel | 55A | |
| Rise Time | 10ns | |
| Fall Time (Typ) | 10 ns | |
| Min Output Voltage | 3V | |
| Fault Protection | Over Temperature | |
| Number of Drivers | 2Drivers | |
| Supply Voltage1-Nom | 12V | |
| High Side Driver | YES | |
| Height | 1.05mm | |
| Length | 6mm | |
| Width | 6mm | |
| REACH SVHC | No SVHC | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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FDMF6823B Documents
Download datasheets and manufacturer documentation for FDMF6823B
- DatasheetsFDMF6823B
- PCN Assembly/OriginFDMF/ZSPM 20/Jul/2016
- Environmental InformationMaterial Declaration FDMF6823B
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
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