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FDN335N Tech Specifications
| Category | Transistors - FETs, MOSFETs - Single | |
| Manufacturer | ON Semiconductor | |
| Lifecycle Status | ACTIVE (Last Updated: 5 days ago) | |
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Number of Pins | 3Pins | |
| Transistor Element Material | SILICON | |
| Manufacturer Package Identifier | CASE 527AG-01 | |
| Current - Continuous Drain (Id) @ 25℃ | 1.7A Ta | |
| Drive Voltage (Max Rds On, Min Rds On) | 2.5V 4.5V | |
| Number of Elements | 1 Element | |
| Power Dissipation (Max) | 500mW Ta | |
| Turn Off Delay Time | 11 ns | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | PowerTrench® | |
| Published | 1999 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Resistance | 70MOhm | |
| Voltage - Rated DC | 20V | |
| Terminal Position | DUAL |
| Terminal Form | GULL WING | |
| Current Rating | 1.7A | |
| Voltage | 20V | |
| Element Configuration | Single | |
| Current | 17A | |
| Operating Mode | ENHANCEMENT MODE | |
| Power Dissipation | 500mW | |
| Turn On Delay Time | 5 ns | |
| FET Type | N-Channel | |
| Transistor Application | SWITCHING | |
| Rds On (Max) @ Id, Vgs | 70m Ω @ 1.7A, 4.5V | |
| Vgs(th) (Max) @ Id | 1.5V @ 250μA | |
| Input Capacitance (Ciss) (Max) @ Vds | 310pF @ 10V | |
| Gate Charge (Qg) (Max) @ Vgs | 5nC @ 4.5V | |
| Rise Time | 8.5ns | |
| Vgs (Max) | ±8V | |
| Fall Time (Typ) | 8.5 ns | |
| Continuous Drain Current (ID) | 1.7A | |
| Threshold Voltage | 900mV | |
| Gate to Source Voltage (Vgs) | 8V | |
| Drain to Source Breakdown Voltage | 20V | |
| Dual Supply Voltage | 25V | |
| Nominal Vgs | 800 mV | |
| Height | 940μm | |
| Length | 2.92mm | |
| Width | 3.05mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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FDN335N Documents
Download datasheets and manufacturer documentation for FDN335N
- PCN Assembly/OriginMult Dev Assembly/Test Add 8/Jul/2019
- PCN Design/SpecificationMold Compound 08/April/2008 Logo 17/Aug/2017
- DatasheetsFDN335N-ON-Semiconductor-datasheet-85487652.pdf FDN335N-ON-Semiconductor-datasheet-86688453.pdf FDN335N-Fairchild-Semiconductor-datasheet-67131906.pdf FDN335N-Fairchild-Semiconductor-datasheet-67356176.pdf FDN335N-ON-Semiconductor-datasheet-67321133.pdf FDN335N-Fairchild-datasheet-8443005.pdf FDN335N Datasheet FDN335N-ON-Semiconductor-datasheet-9913.pdf FDN335N-Fairchild-Semiconductor-datasheet-10740700.pdf
- Environmental InformationMaterial Declaration FDN335N
- PCN PackagingBinary Year Code Marking 15/Jan/2014 Mult Devices 24/Oct/2017
- ReachStatementFairchild-Semiconductor-FDN335N.pdf
- TechnicalDrawingFairchild-Semiconductor-FDN335N.pdf
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