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FDN352AP Tech Specifications
| Category | Transistors - FETs, MOSFETs - Single | |
| Manufacturer | ON Semiconductor | |
| Lifecycle Status | ACTIVE (Last Updated: 6 days ago) | |
| Factory Lead Time | 10 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Number of Pins | 3Pins | |
| Transistor Element Material | SILICON | |
| Current - Continuous Drain (Id) @ 25℃ | 1.3A Ta | |
| Drive Voltage (Max Rds On, Min Rds On) | 4.5V 10V | |
| Number of Elements | 1 Element | |
| Power Dissipation (Max) | 500mW Ta | |
| Turn Off Delay Time | 10 ns | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Series | PowerTrench® | |
| Published | 2005 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| Termination | SMD/SMT | |
| ECCN Code | EAR99 | |
| Resistance | 180MOhm | |
| Voltage - Rated DC | -30V | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Current Rating | -1.3A |
| Number of Channels | 1Channel | |
| Voltage | 30V | |
| Element Configuration | Single | |
| Current | 13A | |
| Operating Mode | ENHANCEMENT MODE | |
| Power Dissipation | 500mW | |
| Turn On Delay Time | 4 ns | |
| FET Type | P-Channel | |
| Transistor Application | SWITCHING | |
| Rds On (Max) @ Id, Vgs | 180m Ω @ 1.3A, 10V | |
| Vgs(th) (Max) @ Id | 2.5V @ 250μA | |
| Input Capacitance (Ciss) (Max) @ Vds | 150pF @ 15V | |
| Gate Charge (Qg) (Max) @ Vgs | 1.9nC @ 4.5V | |
| Rise Time | 15ns | |
| Vgs (Max) | ±25V | |
| Fall Time (Typ) | 15 ns | |
| Continuous Drain Current (ID) | -1.3A | |
| Threshold Voltage | -2V | |
| Gate to Source Voltage (Vgs) | 25V | |
| Drain to Source Breakdown Voltage | -30V | |
| Dual Supply Voltage | -30V | |
| Max Junction Temperature (Tj) | 150°C | |
| Nominal Vgs | -2 V | |
| Height | 1.22mm | |
| Length | 2.92mm | |
| Width | 1.4mm | |
| REACH SVHC | No SVHC | |
| Radiation Hardening | No | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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FDN352AP Documents
Download datasheets and manufacturer documentation for FDN352AP
- PCN Assembly/OriginMult Dev Assembly/Test Add 8/Jul/2019
- PCN Design/SpecificationMold Compound 08/April/2008 Logo 17/Aug/2017
- DatasheetsFDN352AP FDN352AP-ON-Semiconductor-datasheet-85488109.pdf FDN352AP-Fairchild-Semiconductor-datasheet-67795857.pdf FDN352AP-ON-Semiconductor-datasheet-81454838.pdf FDN352AP-ON-Semiconductor-datasheet-137405270.pdf FDN352AP.-Fairchild-datasheet-8426562.pdf FDN352AP-Fairchild-Semiconductor-datasheet-67476552.pdf FDN352AP-ON-Semiconductor-datasheet-93824.pdf FDN352AP-Fairchild-Semiconductor-datasheet-14042213.pdf
- Environmental InformationMaterial Declaration FDN352AP
- PCN PackagingBinary Year Code Marking 15/Jan/2014 Mult Devices 24/Oct/2017
- ReachStatementFairchild-Semiconductor-FDN352AP.pdf
- TechnicalDrawingFairchild-Semiconductor-FDN352AP.pdf
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