IN STOCK
: 30000
Min. : 1
Mult. : 1

Not available to buy on line? Want the lower wholesale price? Please sendRFQ, we will respond immediately
FSA8108BUCX Tech Specifications
| Category | Interface - Specialized | |
| Manufacturer | ON Semiconductor | |
| Lifecycle Status | LAST SHIPMENTS (Last Updated: 1 week ago) | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 12-UFBGA, WLCSP | |
| Number of Pins | 12Pins | |
| Weight | 63mg | |
| Packaging | Tape & Reel (TR) | |
| Published | 2016 | |
| JESD-609 Code | e1 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 12Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Max Operating Temperature | 85°C | |
| Min Operating Temperature | -40°C | |
| Applications | Cell Phone | |
| HTS Code | 8542.39.00.01 | |
| Voltage - Supply | 2.7V~4.5V |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.8V | |
| Terminal Pitch | 0.4mm | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Base Part Number | FSA8108 | |
| Output | SEPARATE OUTPUT | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 4.5V | |
| Power Supplies | 2.7/4.5V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 2.7V | |
| Analog IC - Other Type | ANALOG CIRCUIT | |
| On-State Resistance (Max) | 2.5Ohm | |
| Switching | BREAK-BEFORE-MAKE | |
| Normal Position | NO | |
| Height | 378μm | |
| Length | 1.56mm | |
| Width | 1.16mm | |
| RoHS Status | RoHS Compliant |
Select at least one checkbox above to show similar products in this category.
FSA8108BUCX Documents
Download datasheets and manufacturer documentation for FSA8108BUCX
- DatasheetsFSA8108 Limited Datasheet FSA8108BUCX-ON-Semiconductor-datasheet-85541171.pdf FSA8108BUCX-Fairchild-Semiconductor-datasheet-17289312.pdf
- PCN Obsolescence/ EOL3Q Mult Dev EOL 9/Nov/2017
- PCN Assembly/OriginWLCSP Back-End Process Flow 22/Oct/2013
- ReachStatementFairchild-Semiconductor-FSA8108BUCX.pdf
- PCN Design/SpecificationLogo 17/Aug/2017
- PCN PackagingMult Devices 24/Oct/2017
- TechnicalDrawingFairchild-Semiconductor-FSA8108BUCX.pdf
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ
