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- MMBZ6V2ALT1G
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MMBZ6V2ALT1G Tech Specifications
| Category | TVS - Diodes | |
| Manufacturer | ON Semiconductor | |
| Lifecycle Status | ACTIVE (Last Updated: 1 day ago) | |
| Factory Lead Time | 4 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | TO-236-3, SC-59, SOT-23-3 | |
| Surface Mount | YES | |
| Number of Pins | 3Pins | |
| Diode Element Material | SILICON | |
| Breakdown Voltage / V | 5.89V | |
| Number of Elements | 2 Elements | |
| Operating Temperature | -55°C~150°C TJ | |
| Packaging | Tape & Reel (TR) | |
| Published | 2007 | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
| Number of Terminations | 3Terminations | |
| ECCN Code | EAR99 | |
| Type | Zener | |
| Terminal Finish | Tin (Sn) | |
| Applications | General Purpose |
| HTS Code | 8541.10.00.50 | |
| Power Rating | 24W | |
| Voltage - Rated DC | 6.2V | |
| Terminal Position | DUAL | |
| Terminal Form | GULL WING | |
| Peak Reflow Temperature (Cel) | 260 | |
| Current Rating | 1A | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Base Part Number | MMBZ*A | |
| Pin Count | 3 | |
| Polarity | UNIDIRECTIONAL | |
| Power Dissipation | 225mW | |
| Power Line Protection | No | |
| Current - Peak Pulse (10/1000μs) | 2.76A | |
| Voltage - Clamping (Max) @ Ipp | 8.7V | |
| Voltage - Reverse Standoff (Typ) | 3V | |
| Unidirectional Channels | 2 | |
| Rep Pk Reverse Voltage-Max | 3V | |
| Reverse Current-Max | 0.5μA | |
| Clamping Voltage-Max | 8.7V | |
| Reverse Test Voltage | 3V | |
| RoHS Status | ROHS3 Compliant | |
| Lead Free | Lead Free |
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MMBZ6V2ALT1G Documents
Download datasheets and manufacturer documentation for MMBZ6V2ALT1G
- DatasheetsMMBZ/SZMMBZyyyALT1 Series MMBZ6V2ALT1G-ON-Semiconductor-datasheet-153450.pdf MMBZ6V2ALT1G-ON-Semiconductor-datasheet-78758892.pdf MMBZ6V2ALT1G-ON-Semiconductor-datasheet-34436564.pdf MMBZ6V2ALT1G-ON-Semiconductor-datasheet-8364014.pdf MMBZ6V2ALT1G-ON-Semiconductor-datasheet-11723552.pdf
- Environmental InformationMaterial Declaration MMBZ6V2ALT1G
- PCN Design/SpecificationGlue Mount Process 11/July/2008 SOT23 16/Sep/2016
- PCN Assembly/OriginMold Compound 20/Sep/2019
- ReachStatementON-Semiconductor-company-79.pdf
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