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NC7WZ38K8X Tech Specifications
Category | Logic - Gates and Inverters | |
Manufacturer | ON Semiconductor | |
Lifecycle Status | ACTIVE (Last Updated: 3 days ago) | |
Factory Lead Time | 6 Weeks | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 8-VFSOP (0.091, 2.30mm Width) | |
Number of Pins | 8Pins | |
Weight | 30mg | |
Operating Temperature | -40°C~85°C | |
Packaging | Tape & Reel (TR) | |
Series | 7WZ | |
Published | 2003 | |
JESD-609 Code | e3 | |
Pbfree Code | yes | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 8Terminations | |
ECCN Code | EAR99 | |
Terminal Finish | Tin (Sn) | |
Packing Method | TAPE AND REEL | |
Voltage - Supply | 1.65V~5.5V | |
Terminal Position | DUAL | |
Terminal Form | GULL WING |
Number of Functions | 2Functions | |
Supply Voltage | 1.8V | |
Terminal Pitch | 0.5mm | |
Base Part Number | 7WZ38 | |
Number of Outputs | 1Output | |
Supply Voltage-Max (Vsup) | 5.5V | |
Power Supplies | 3.3V | |
Load Capacitance | 50pF | |
Propagation Delay | 9.6 ns | |
Quiescent Current | 1μA | |
Turn On Delay Time | 9.2 ns | |
Family | LVC/LCX/Z | |
Logic Function | NAND | |
Logic Type | NAND Gate | |
Number of Gates | 2Gates | |
Max Propagation Delay @ V, Max CL | 3.4ns @ 5V, 50pF | |
Prop. Delay@Nom-Sup | 4.5 ns | |
Schmitt Trigger | NO | |
Features | Open Drain | |
Height Seated (Max) | 0.9mm | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant | |
Lead Free | Lead Free |
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NC7WZ38K8X Documents
Download datasheets and manufacturer documentation for NC7WZ38K8X
- PCN Design/SpecificationMult Dev Mat/DS Chg 2/Oct/2018 Logo 17/Aug/2017
- DatasheetsNC7WZ38K8X-ON-Semiconductor-datasheet-137000752.pdf NC7WZ38K8X-ON-Semiconductor-datasheet-101150042.pdf NC7WZ38K8X-Fairchild-datasheet-7592495.pdf NC7WZ38K8X-Fairchild-datasheet-133889.pdf NC7WZ38K8X-Fairchild-Semiconductor-datasheet-14044844.pdf
- Environmental InformationMaterial Declaration NC7WZ38K8X
- ReachStatementFairchild-Semiconductor-NC7WZ38K8X.pdf
- PCN PackagingMult Devices 24/Oct/2017
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